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Thema
- substrates 34 Treffer
- bonding 33 Treffer
- silicon 25 Treffer
- surface treatment 20 Treffer
- films 17 Treffer
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45 weitere Werte:
- gold 14 Treffer
- resistance 14 Treffer
- heating 13 Treffer
- conductivity 12 Treffer
- copper 12 Treffer
- joints 11 Treffer
- reliability 11 Treffer
- temperature 11 Treffer
- temperature measurement 11 Treffer
- impedance 10 Treffer
- three-dimensional displays 10 Treffer
- surface morphology 9 Treffer
- assembly 8 Treffer
- metals 8 Treffer
- packaging 8 Treffer
- semiconductor device measurement 8 Treffer
- soldering 8 Treffer
- strain 8 Treffer
- stress 8 Treffer
- electrodes 7 Treffer
- nanoparticles 7 Treffer
- plasmas 7 Treffer
- polymers 7 Treffer
- silver 7 Treffer
- annealing 6 Treffer
- finite element analysis 6 Treffer
- flip-chip devices 6 Treffer
- force 6 Treffer
- integrated circuit modeling 6 Treffer
- light emitting diodes 6 Treffer
- noise 6 Treffer
- plasma temperature 6 Treffer
- rough surfaces 6 Treffer
- glass 5 Treffer
- loading 5 Treffer
- microstructure 5 Treffer
- mosfet 5 Treffer
- nickel 5 Treffer
- radiation effects 5 Treffer
- resins 5 Treffer
- standards 5 Treffer
- surface roughness 5 Treffer
- temperature distribution 5 Treffer
- thermal analysis 5 Treffer
- thermal conductivity 5 Treffer
Publikation
- 2015 international conference on electronics packaging and imaps all asia conference (icep-iaac), electronics packaging and imaps all asia conference (icep-iacc), 2015 international conference on 149 Treffer
- 2016 international conference on electronics packaging (icep), electronics packaging (icep), 2016 international conference on 4 Treffer
Inhaltsanbieter
153 Treffer
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 791-794Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 464-467Online KonferenzZugriff:
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In: 2016 International Conference on Electronics Packaging (ICEP), 2016-04-01, S. 405-410Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 98-101Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 174-179Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 170-173Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 571-574Online KonferenzZugriff:
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In: 2016 International Conference on Electronics Packaging (ICEP), 2016-04-01, S. 179-183Online KonferenzZugriff:
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In: 2016 International Conference on Electronics Packaging (ICEP), 2016-04-01, S. 173-178Online KonferenzZugriff:
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In: 2016 International Conference on Electronics Packaging (ICEP), 2016-04-01, S. 329-332Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 65-68Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 1-21Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 74-77Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 56-60Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 61-64Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 69-73Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 144-148Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 78-82Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 157-160Online KonferenzZugriff:
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In: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015-04-01, S. 93-97Online KonferenzZugriff: