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Weniger Treffer
Art der Quelle
Thema
- engineered materials, dielectrics and plasmas 19 Treffer
- signal processing and analysis 18 Treffer
- bioengineering 17 Treffer
- power, energy and industry applications 17 Treffer
- fields, waves and electromagnetics 16 Treffer
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45 weitere Werte:
- communication, networking and broadcast technologies 14 Treffer
- computing and processing 11 Treffer
- robotics and control systems 10 Treffer
- packaging 6 Treffer
- stacking 6 Treffer
- through-silicon vias 6 Treffer
- engineering profession 5 Treffer
- aerospace 4 Treffer
- bonding 4 Treffer
- etching 4 Treffer
- micromechanical devices 4 Treffer
- nuclear engineering 4 Treffer
- photonics 4 Treffer
- transportation 4 Treffer
- two dimensional displays 4 Treffer
- copper 3 Treffer
- fabrication 3 Treffer
- general topics for engineers 3 Treffer
- polymers 3 Treffer
- radiation effects 3 Treffer
- reliability 3 Treffer
- resistance 3 Treffer
- solid modeling 3 Treffer
- substrates 3 Treffer
- 3d ic 2 Treffer
- 3d packaging 2 Treffer
- advanced packaging 2 Treffer
- detectors 2 Treffer
- electrodes 2 Treffer
- electronics packaging 2 Treffer
- finite element analysis 2 Treffer
- heating systems 2 Treffer
- heterogeneous integration 2 Treffer
- logic gates 2 Treffer
- needles 2 Treffer
- pressure sensors 2 Treffer
- semiconductor device modeling 2 Treffer
- sensitivity 2 Treffer
- shape 2 Treffer
- silicon nitride 2 Treffer
- thermal analysis 2 Treffer
- thermal modeling 2 Treffer
- very large scale integration 2 Treffer
- 2.5d/3d 1 Treffer
- 3d stack 1 Treffer
Verlag
Publikation
- 2021 22nd international conference on electronic packaging technology (icept), electronic packaging technology (icept), 2021 22nd international conference on 5 Treffer
- 2014 ieee 64th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2014 ieee 64th 3 Treffer
- 2018 ieee nuclear science symposium and medical imaging conference proceedings (nss/mic), nuclear science symposium and medical imaging conference proceedings (nss/mic), 2018 ieee 3 Treffer
- 2018 international conference on electronics packaging and imaps all asia conference (icep-iaac), electronics packaging and imaps all asia conference (icep-iaac), 2018 international conference on 2 Treffer
- 2020 china semiconductor technology international conference (cstic), semiconductor technology international conference (cstic), 2020 china 2 Treffer
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27 weitere Werte:
- 2021 international conference on numerical simulation of optoelectronic devices (nusod), numerical simulation of optoelectronic devices (nusod), 2021 international conference on 2 Treffer
- 2023 ieee 73rd electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2023 ieee 73rd, ectc 2 Treffer
- 2013 ieee international interconnect technology conference - iitc, interconnect technology conference (iitc), 2013 ieee international 1 Treffer
- 2015 symposium on vlsi circuits (vlsi circuits), vlsi circuits (vlsi circuits), 2015 symposium on 1 Treffer
- 2015 transducers - 2015 18th international conference on solid-state sensors, actuators and microsystems (transducers), solid-state sensors, actuators and microsystems (transducers), 2015 transducers - 2015 18th international conference on 1 Treffer
- 2016 17th international conference of young specialists on micro/nanotechnologies and electron devices (edm), micro/nanotechnologies and electron devices (edm), 2016 17th international conference of young specialists on 1 Treffer
- 2016 ieee 11th annual international conference on nano/micro engineered and molecular systems (nems), nano/micro engineered and molecular systems (nems), 2016 ieee 11th annual international conference on 1 Treffer
- 2016 ieee international conference on semiconductor electronics (icse), semiconductor electronics (icse), 2016 ieee international conference on 1 Treffer
- 2017 47th european solid-state device research conference (essderc), solid-state device research conference (essderc), 2017 47th european 1 Treffer
- 2017 5th international workshop on low temperature bonding for 3d integration (ltb-3d), low temperature bonding for 3d integration (ltb-3d), 2017 5th international workshop on 1 Treffer
- 2017 panhellenic conference on electronics and telecommunications (pacet), electronics and telecommunications (pacet), 2017 panhellenic conference on 1 Treffer
- 2017 symposium on vlsi technology, vlsi technology, 2017 symposium on 1 Treffer
- 2018 17th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2018 17th ieee intersociety conference on 1 Treffer
- 2018 european conference on optical communication (ecoc), optical communication (ecoc), 2018 european conference on 1 Treffer
- 2018 ieee 13th annual international conference on nano/micro engineered and molecular systems (nems), nano/micro engineered and molecular systems (nems), 2018 ieee 13th annual international conference on 1 Treffer
- 2018 ieee international conference on manipulation, manufacturing and measurement on the nanoscale (3m-nano), manipulation, manufacturing and measurement on the nanoscale (3m-nano), 2018 ieee international conference on 1 Treffer
- 2019 ieee 21st electronics packaging technology conference (eptc), electronics packaging technology conference (eptc), 2019 ieee 21st 1 Treffer
- 2020 asia communications and photonics conference (acp) and international conference on information photonics and optical communications (ipoc), information photonics and optical communications (ipoc), 2020 asia communications and photonics conference (acp) and international conference on 1 Treffer
- 2020 ieee 63rd international midwest symposium on circuits and systems (mwscas), circuits and systems (mwscas), 2020 ieee 63rd international midwest symposium on 1 Treffer
- 2021 conference on lasers and electro-optics (cleo), lasers and electro-optics (cleo), 2021 conference on 1 Treffer
- 2021 ieee 16th international conference on nano/micro engineered and molecular systems (nems), nano/micro engineered and molecular systems (nems), 2021 ieee 16th international conference on 1 Treffer
- 2021 ieee 17th international conference on group iv photonics (gfp), group iv photonics (gfp), 2021 ieee 17th international conference on 1 Treffer
- 2022 ieee international symposium on hardware oriented security and trust (host), hardware oriented security and trust (host), 2022 ieee international symposium on 1 Treffer
- 2022 international electron devices meeting (iedm), electron devices meeting (iedm), 2022 international 1 Treffer
- 2023 10th international conference on computing for sustainable global development (indiacom), computing for sustainable global development (indiacom), 2023 10th international conference on 1 Treffer
- 2024 conference of science and technology for integrated circuits (cstic), science and technology for integrated circuits (cstic), 2024 conference of 1 Treffer
- 2024 international conference on electronics packaging (icep), electronics packaging (icep), 2024 international conference on 1 Treffer
Inhaltsanbieter
44 Treffer
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In: 2021 IEEE 17th International Conference on Group IV Photonics (GFP), 2021-12-01, S. 1-2Online KonferenzZugriff:
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In: 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018-05-01, S. 318-324Online KonferenzZugriff:
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In: 2016 17th International Conference of Young Specialists on Micro/Nanotechnologies and Electron Devices (EDM), 2016-06-01, S. 22-25Online KonferenzZugriff:
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In: 2021 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD), 2021-09-13, S. 55-56Online KonferenzZugriff:
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In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC), 2024-03-17, S. 1-4Online KonferenzZugriff:
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In: 2024 International Conference on Electronics Packaging (ICEP), 2024-04-17, S. 105-106Online KonferenzZugriff:
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In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023-05-01, S. 1767-1772Online KonferenzZugriff:
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In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023-05-01, S. 1749-1753Online KonferenzZugriff:
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In: 2023 10th International Conference on Computing for Sustainable Global Development (INDIACom), 2023-03-15, S. 396-400Online KonferenzZugriff:
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In: 2022 IEEE International Symposium on Hardware Oriented Security and Trust (HOST), 2022-06-27, S. 17-20Online KonferenzZugriff:
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In: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2017-05-01, S. 17-17Online KonferenzZugriff:
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In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021-09-14, S. 1-4Online KonferenzZugriff:
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In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021-09-14, S. 1-4Online KonferenzZugriff:
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In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021-09-14, S. 1-4Online KonferenzZugriff:
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In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021-09-14, S. 1-4Online KonferenzZugriff:
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In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021-09-14, S. 1-6Online KonferenzZugriff:
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In: 2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS), 2021-04-25, S. 1745-1748Online KonferenzZugriff:
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In: 2022 International Electron Devices Meeting (IEDM), 2022-12-03, S. 1Online KonferenzZugriff:
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In: 2020 IEEE 63rd International Midwest Symposium on Circuits and Systems (MWSCAS), 2020-08-01, S. 537-540Online KonferenzZugriff:
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In: 2020 China Semiconductor Technology International Conference (CSTIC), 2020-06-26, S. 1-5Online KonferenzZugriff: