环氧树脂板二氧化锰−硫酸体系化学粗化工艺. (Chinese)

The epoxy resin (EP) plate was roughened in a solution composed of manganese dioxide and sulfuric acid to improve the adhesion strength of Cu coating electrolessly plated on it. The effects of the volume fraction of sulfuric acid in roughening solution and the roughening time on the surface morphology and hydrophilicity of EP as well as its adhesion to the subsequently plated Cu coating were studied. The roughening process parameters were optimized as follows: MnO2 60 g/L, sulfuric acid 71.0% (volume fraction), temperature 60 °C, and time 15 min. Some uniform and compact quasi-spherical micropores were formed on the surface of EP plate after being roughened thereunder, which had a water contact angle of 12.2°. The adhesion strength between the EP substrate and Cu coating reached 7.0 N/cm. [ABSTRACT FROM AUTHOR]

采用二氧化锰−硫酸体系粗化环氧树脂(EP)板，以增强后续化学镀 Cu 层的结合强度。研究了粗化液中硫酸体积分数和粗 化时间对 EP 基体表面形貌、亲水性及其与 Cu 镀层结合强度的影响，得到较优的粗化工艺条件为：MnO2质量浓度 60 g/L，硫 酸体积分数 71.0%，温度 60 °C，粗化时间 15 min。在该条件下粗化后 EP 表面形成均匀致密的准球形微孔，水接触角为 12.2°， 与化学镀 Cu 层的结合强度达 7.0 N/cm。 [ABSTRACT FROM AUTHOR]

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