Topical metformin accelerates wound healing by promoting collagen synthesis and inhibiting apoptosis in a diabetic wound model.
In: International Wound Journal, Jg. 21 (2024), Heft 1, S. 1-12
Online
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Zugriff:
The wound healing process, which is a pathophysiological process that includes various phases, is interrupted in diabetes due to hyperglycemia, and since deterioration occurs in these phases, a normal healing process is not observed. The aim of the current study is to investigate the proliferative and antiapoptotic effects of metformin on wound healing after topical application on diabetic and non‐diabetic wounds. For this purpose, we applied metformin topically on the full‐thickness excisional wound model we created in diabetic and nondiabetic groups. We investigated the effects of metformin on the apoptotic index by the Terminal deoxynucleotidyl transferase mediated dUTP Nick‐End Labeling method and on collagen‐I, collagen‐III, p53, and c‐jun expression levels by quantitative reverse transcription polymerase chain reaction technique in wound biopsy tissues. Our results showed that c‐jun and p53 mRNA levels and apoptotic index increased with the effect of diabetes, while collagen synthesis was disrupted. As a result of the study, we showed that metformin increases cellular proliferation and has anti‐apoptotic effects by increasing collagen‐I/III expression and decreasing p53/c‐jun level, especially in diabetic wounds and also in normal wounds. In conclusion, the topical effect of metformin on diabetic wounds reversed the adverse effects caused by diabetes, increasing the wound healing rate and improving the wound repair process. [ABSTRACT FROM AUTHOR]
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Titel: |
Topical metformin accelerates wound healing by promoting collagen synthesis and inhibiting apoptosis in a diabetic wound model.
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Autor/in / Beteiligte Person: | Tombulturk, Fatma Kubra ; Soydas, Tugba ; Kanigur‐Sultuybek, Gönül |
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Zeitschrift: | International Wound Journal, Jg. 21 (2024), Heft 1, S. 1-12 |
Veröffentlichung: | 2024 |
Medientyp: | academicJournal |
ISSN: | 1742-4801 (print) |
DOI: | 10.1111/iwj.14345 |
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