Physical and Thermal Characteristics of the Advanced Package with Glass Core Substrate
In: International Conference on Electronics Packaging (ICEP); (2024-04-17) S. 173-174
Online
Konferenz
Zugriff:
Titel: |
Physical and Thermal Characteristics of the Advanced Package with Glass Core Substrate
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Autor/in / Beteiligte Person: | Mitarai, S. ; Adachi, K. ; Igarashi, T. ; Seki, K. ; Kakoiyama, N. ; Tanaka, Y. ; Oka, S. ; Nakazawa, M. ; Iwamoto, H. |
Link: | |
Quelle: | International Conference on Electronics Packaging (ICEP); (2024-04-17) S. 173-174 |
Veröffentlichung: | 2024 |
Medientyp: | Konferenz |
ISBN: | 978-4-9911911-7-6 (print) |
DOI: | 10.23919/ICEP61562.2024.10535616 |
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