Large-Scale Cu Interconnection of Organic Substrate Materials Through Electroless Plating Technology
In: International Conference on Electronics Packaging (ICEP); (2024-04-17) S. 1-2
Online
Konferenz
Zugriff:
Titel: |
Large-Scale Cu Interconnection of Organic Substrate Materials Through Electroless Plating Technology
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Autor/in / Beteiligte Person: | Shih, M. L. ; Shih, P. S. ; Huang, J. H. ; Chen, I. A. ; Wang, J. S. ; Ko, C. T. ; Lin, B. R. ; Yang, K. M. ; Lin, C. H. ; Lee, A. S. ; Kao, C. R. |
Link: | |
Quelle: | International Conference on Electronics Packaging (ICEP); (2024-04-17) S. 1-2 |
Veröffentlichung: | 2024 |
Medientyp: | Konferenz |
ISBN: | 978-4-9911911-7-6 (print) |
DOI: | 10.23919/ICEP61562.2024.10535688 |
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