Development of low temperature solder alloys for advanced electronic packaging: Assessment of In-Bi alloys on Cu substrates
In: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC); (2018-04-01) S. 128-131
Online
Konferenz
Zugriff:
Titel: |
Development of low temperature solder alloys for advanced electronic packaging: Assessment of In-Bi alloys on Cu substrates
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Autor/in / Beteiligte Person: | Wu, Albert T. ; Chen, Chih-Hao ; Huang, Jyun-Jhe ; Chiang, Jeng-Yu ; Wang, Chang-Meng |
Link: | |
Quelle: | International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC); (2018-04-01) S. 128-131 |
Veröffentlichung: | 2018 |
Medientyp: | Konferenz |
ISBN: | 978-4-9902188-5-0 (print) ; 978-4-9902188-4-3 (print) |
DOI: | 10.23919/ICEP.2018.8374686 |
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