Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 12 (2022-03-01), Heft 3, S. 446-453
Online
academicJournal
Zugriff:
Titel: |
Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding
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Autor/in / Beteiligte Person: | Vuorinen, V. ; Ross, G. ; Klami, A. ; Dong, H. ; Paulasto-Krockel, M. ; Wernicke, T. ; Ponninger, A. |
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Zeitschrift: | IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 12 (2022-03-01), Heft 3, S. 446-453 |
Veröffentlichung: | 2022 |
Medientyp: | academicJournal |
ISSN: | 2156-3950 (print) ; 2156-3985 (print) |
DOI: | 10.1109/TCPMT.2021.3111345 |
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