Study on Gaussian Process Regression to Predict Reliability Life of Wafer Level Packaging with cluster analysis
In: 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT); (2022-10-26) S. 1-4
Online
Konferenz
Zugriff:
Titel: |
Study on Gaussian Process Regression to Predict Reliability Life of Wafer Level Packaging with cluster analysis
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Autor/in / Beteiligte Person: | Chang, C.Y. ; Chang, H. M. ; Chiang, K.N. |
Link: | |
Quelle: | 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT); (2022-10-26) S. 1-4 |
Veröffentlichung: | 2022 |
Medientyp: | Konferenz |
ISBN: | 978-1-6654-5221-2 (print) |
ISSN: | 2150-5942 (print) |
DOI: | 10.1109/IMPACT56280.2022.9966714 |
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